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Semiconductor Reject Wafers

Round (unbroken) wafers

Poseidon has the capability to process 500,000 pcs/month of these wafers. The processes are suitable to remove virtually all kinds of coatings that are applied in the semiconductor industry such as metals, oxides, metal silicides, and polyimide. These wafers are 100% tested for resistivity and dopant type. Silicon removal (loss) ranges from 0.2um to a maximum of 10um. For a typical 200mm wafer this loss amounts to a maximum of 1.5%

Broken wafers

Poseidon has the capability to process 50 MT/month of these wafers. The processes are suitable to remove virtually all kinds of coatings that are applied in the semiconductor industry such as metals, oxides, metal silicides, and polyimide. These wafers are sample tested for resistivity and dopant type. Silicon loss is <3%. This includes patterned (IP)
wafers.

Patterned (IP) wafers

Poseidon has the capability to process 100,000 pcs/month of these wafers (200 mm equivalent). We guarantee destruction of all IP without any trace. A dedicated store for these wafers that is scanned by CCTV on a 24X7 basis is provided. In addition, SGS inspection can be arranged to confirm quantities and IP removal.

 

Photo of wafers before and after IP destruction

 

Test / Dummy wafers

Poseidon has the capability to convert low res wafers to be used as test wafers for the semiconductor industry. Each wafer is cleaned and polished to a mirror finish suitable for use as dummy wafers.

Please contact us if you are in need of test wafers as we constantly source such wafers for our customers.